| PART |
Description |
Maker |
| SD-70287-004 0702871009 |
2.54mm (.100") Pitch C-Grid庐 Header
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| 0907092601 90709-2601 |
2.54mm (.100) Pitch, C-Grid? Header
2.54mm (.100") Pitch, C-Grid垄莽 Header
|
Molex Electronics Ltd.
|
| 0022282049 22-28-2049 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Backwalls Removed
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, with Backwalls Remove
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 4 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, with Backwalls Rem
|
Molex Electronics Ltd.
|
| 0942460012 |
2.54mm (.100) Pitch, MOX Header, 2.54mm (.100) Grid, Through Hole
2.54mm (.100") Pitch, MOX Header, 2.54mm (.100") Grid, Through Hole
|
Molex Electronics Ltd.
|
| 85013-3081 0850133081 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭) Selective Gold (Au), 96 Circuits
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛) Selective Gold (Au), 96 Circuits
|
Molex Electronics Ltd.
|
| 0702800458 70280-0458 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0901200843 90120-0843 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 3 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
MOLEX Connector
|
Molex Electronics Ltd.
|
| A-7478-06A501 22-12-2064 |
2.54mm (.100) Pitch KK庐 Solid Header, Right Angle, with Friction Lock, 6 Circuits, 0.51渭m (20渭) Gold (Au) Plating
2.54mm (.100) Pitch KK? Solid Header, Right Angle, with Friction Lock, 6 Circuits, 0.51μm (20μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
| 0022122124 22-12-2124 A-7478-12A501 |
2.54mm (.100) Pitch KK? Solid Header, Right Angle, with Friction Lock, 12 Circuits, 0.51μm (20μ) Gold (Au) Plating
2.54mm (.100) Pitch KK垄莽 Solid Header, Right Angle, with Friction Lock, 12 Circuits, 0.51楼矛m (20楼矛) Gold (Au) Plating
|
Molex Electronics Ltd.
|
|
